| PUTTY SHEET TYPE |
Highly Thermally Conductive and Non-Flammable interface materials
SARCON Silicone Extremely Compressible Gap filler Type (Putty sheet type) is a highly conductive and themally conductive non-flammable interface materials.The surface consistency is excellent for filling small air gaps and uneven mating surfaces making rellable contact with various shapes and sizes of components.
| View this information in jour catalog |
The Silicone putty type is a heat-dissipating putty sheet that is clay-like and adheres well to unevenness such as electronic components.
- Silicone putty sheet with thermal conductivity, flame retardancy, and electrical insulation.
- Since it is clay-shaped, the gap between the heating element and the heat diffusion / heat dissipation body such as the heat sink can be uniformly filled with a thin film.
- Since it also has excellent adhesion to uneven and curved surfaces, it demonstrates highly reliable heat transfer performance.
- It is easier to handle than grease or phase-change type thermal conductive materials.
| Recommended Application |
| List of SARCON Compound types |
| SARCON | Application Guidelines | Typical Thermal Conductivity | |
| Cal/cm - sec - °C | Watt/M.K | ||
| SARCON PG25A | Lowest modulus, putty-like gap filler available | 6.0 x 10-3 | 2.5 |
| SARCON PG45A | Lowest modulus, putty-like gap filler available | - | 4.5 |
| SARCON PG80B | High performance thermal conductivity gap filler pad | 19.1 x 10-3 | 8 |
| SARCON PG130A | Very high thermal conductivity putty | 26.3 x 10-3 | 13.00 |
| Thermal Resistance Data |
Presure : 300KPa (43.5psi)
Original Thickness (mm)
Measured by using ASTM D5470 equivalent (TIM tester 1300) ,
refer to FUJIPOLY Test method "FTM P-3050". -> See P.44
Original Thickness is the initial thickness of sarcon before pressing.
| Compression Load Correlation of FUJIPOLY TIM Pad Products |
| APPLICATIONS |
- Between chassis wall and heat sink
- Between CPU and heat sink
- Between semiconductor and heat sink
- Component to heat spreader
