Highly Thermally Conductive and Electrically Insulative Silicone free Compound.

 SARCON Non-Silicone Form in Place Gap Filler Type is highly conformable and highly thermal conductive type silicone free compound with very low compression force. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. SARCON Non-Silicone Form in Place Gap Filler Type is suitable for filling delicate gaps and still provide superior thermal transfer. 

• Suitable for filling delicate gaps and still provide superior thermal transfer.
• Highly conformable with very low compression forces.
• Has excellent vibration absorption capabilities.
• Maintains thermal properties across a wide temperature range.
• Can be used to "Form-In-Place" and will remain form stable.
• Requires no heat curing.
• Will not cause corrosion on any metal surface.
• silicone free

• Syringe                   : 30cc
• Jar                          : 1kg
• Custom packaging : Avlailable on request

                          Test method: Measured by ASTM D575-91 for reference. See P.46

• Specimen Area; DIA.28.6mm (1.13in) 
• Platens Area; DIA. 28.6mm(1.13in)
• Sustain: Sustain at o.5mm/0.25m for 1 Minute
• Compression Velocity; 5.0mm/minute 
• Setting Gap : 0.5mm or 1.0mm(Initial Gap)
• The specimen is pressed till setting a gap and then waiting for load to settle down.

 Viscosity : Measured by Brookfield Viscometer @5rpm Themal Conductivity : Measured by Hot Disk Test method according to ISO 22007-2