Form In Place Gap Filler Type |
Highly Thermally Conductive and Electricity Insulative Silicone Compound
SARCON Form in Place Gap Filler Type is a highly conformable / thermally conductive type silicone compound.
It Provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic device.
SACON Form in Place Gap Filler Type easily forms and adheres to most surfaces shape and size of components.
View this information in our catalog. |
Features |
- Fill large gaps while providing superior thermal transfer.
- Conformable with very low compression forces.
- Excellent vibration absorption capabilities.
- Maintains all initial properties across a wide temperature range.
- Used to "Form-in-Place" and remain form stable.
- Requires no heat curing.
- Will Not cause corrosion on any metal surface.
Recommended Applications |
- SARCON Form in Place Gap Filler Type is Superior to filling faps as well as dissipating heat.
- Excellent workability / Handling with its softness but no dripping and no pumping.
Packaging Options |
- Pre-filledf syringes : 30ml
- Jar containers : 325ml
- Custorm packaging : Available on request
Compression Load Correlation of FUJIPOLY TIM Pad Products |
Compression Force |
a) Relaxing : Relief of the forth in 1 minute later.
b) Measured by "ASTM D575-91" for reference. -> See P.46